Lef Circuits assemble both through-hole and surface-mount components (SMT).
We can assemble using lead-free solder (Rohs compliant) or tin lead solder (for Rohs exempt products).
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Fast turnaround prototype through to production quantities. |
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Automated & manual surface mount PCB assembly. |
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BGA, TQFP, TSSOP, SOIC ... assembly. |
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Conventional through hole PCB assembly. |
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Electromechanical / Box assembly. |
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Full or part component procurement.
(PCBs assembled from free issue parts). |
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X,Y placement file creation. |
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Solder paste file creation. |
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Functional test, in-circuit test. |
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Scheduled orders (Kanban, JIT, etc). |
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Confidentiality guaranteed. Non-disclosure agreements available if required. |
